JUQ‑867 emerges as a that simultaneously satisfies the historically conflicting requirements of ultra‑low thermal expansion, high thermal conductivity, and low dielectric loss. The material’s performance in a mmWave power‑amplifier demonstrator validates its practical impact on frequency stability and power handling—key metrics for 5 G/6 G, high‑power LED drivers, and future quantum‑device packaging. Ongoing work focuses on large‑area roll‑to‑roll SPS processing and integration with advanced 3D‑stacked heterogeneous systems.
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